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  may 2011 doc id 018819 rev 1 1/7 7 STPS60SM200C power schottky rectifier features high reverse voltage (200 v) low forward voltage drop high frequency operation description the STPS60SM200C is a dual schottky rectifier suited for high frequency switched-mode power supply. housed in to-247, this devi ce is especially suited for use in telecom base station smps, providing these applications with a good efficiency at both low and high load. table 1. device summary symbol value i f(av) 2 x 30 a v rrm 200 v t j (max) 175 c v f (typ) 640 mv a1 k a2 a1 a2 k to-247 STPS60SM200Cw www.st.com
characteristics STPS60SM200C 2/7 doc id 018819 rev 1 1 characteristics when the two diodes 1 and 2 are used simultaneously: t j (diode 1) = p(diode 1) x r th(j-c) (per diode) + p(diode 2) x r th(c) to evaluate the conduction losses use the following equation: p = 0.58 x i f(av) + 0.0037 x i f 2 (rms) table 2. absolute ratings (limiting values per diode at 25 c, unless otherwise specified) symbol parameter value unit v rrm repetitive peak reverse voltage 200 v i f(rms) forward current rms 50 a i f(av) average forward current = 0.5 per diode, = 0.5 t c = 155 c 30 a per device, = 0.5 t c = 150 c 60 i fsm surge non repetitive forward current t p = 10 ms sinusoidal, t c = 25 c 500 a t stg storage temperature range -65 to + 175 c t j maximum operating junction temperature (1) -40 to + 175 c 1. condition to avoid thermal runaway for a diode on its own heatsink dptot dtj < 1 rth(j-a) table 3. thermal resistance symbol parameter value unit r th(j-c) junction to case per diode 0.7 c/w total 0.5 r th(c) coupling 0.3 table 4. static electrical characteristics (per diode) symbol parameter test conditions min. typ. max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm 0.05 ma t j = 125 c 6 13 v f (2) forward voltage drop t j = 25 c i f = 7.5 a 0.67 0.70 v t j = 125 c 0.51 0.55 t j = 25 c i f = 15 a 0.73 0.77 t j = 125 c 0.57 0.61 t j = 25 c i f = 30 a 0.79 0.83 t j = 125 c 0.64 0.69 1. pulse test: t p = 5 ms, < 2% 2. pulse test: t p = 380 s, < 2%
STPS60SM200C characteristics doc id 018819 rev 1 3/7 figure 1. average forward power dissipation versus average forward current (per diode) figure 2. average forward current versus ambient temperature ( = 0.5) 0 5 10 15 20 25 30 35 0 5 10 15 20 25 30 35 40 p (w) f(av) t = t / t p t p i (a) f(av) = 0.05 = 0.1 = 0.2 = 0.5 = 1 0 5 10 15 20 25 30 35 0 25 50 75 100 125 150 175 i (a) f(av) r th(j-a) = r th(j-c) t (c) amb figure 3. non repetitive surge peak forward current versus overload duration (maximum values, per diode) figure 4. relative variation of thermal impedance junction to case versus pulse duration 0 50 100 150 200 250 300 350 400 450 500 1.e-03 1.e-02 1.e-01 1.e+00 i m t = 0.5 i (a) m t = 25 c c t = 75 c c t = 125 c c t(s) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 z/r th(j-c) th(j-c) single pulse t (s) p figure 5. reverse leakage current versus reverse voltage applied (typical values, per diode) figure 6. junction capacitance versus reverse voltage applied (typical values, per diode) 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 0 20 40 60 80 100 120 140 160 180 200 v (v) r i (ma) r t = 25 c j t = 50 c j t = 75 c j t = 125 c j t = 150 c j t = 100 c j 0.1 1.0 10.0 1 10 100 1000 v (v) r c(nf) f = 1 mhz v = 30 mv t = 25 c osc rms j
characteristics STPS60SM200C 4/7 doc id 018819 rev 1 figure 7. forward voltage drop versus forward current (per diode, low level) figure 8. forward voltage drop versus forward current (per diode, high level) 0 5 10 15 20 25 30 35 40 45 50 55 60 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 v (v) fm i (a) fm (maximum values) t = 125 c j (typical values) t = 125 c j (maximum values) t = 25 c j 0.1 1.0 10.0 100.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 i (a) fm v (v) fm (maximum values) t = 25 c j (maximum values) t = 125 c j (typical values) t = 125 c j
STPS60SM200C package information doc id 018819 rev 1 5/7 2 package information epoxy meets ul94, v0 cooling method: by conduction (c) recommended torque value: 0.55 to 1.0 nm in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 5. to-247 dimensions ref. dimensions millimeters inches min. max. min. max. a 4.85 5.16 0.191 0.203 d 2.20 2.60 0.086 0.102 e 0.40 0.80 0.015 0.031 f 1.00 1.40 0.039 0.055 f1 3.00 typ. 0.118 typ. f2 2.00 typ. 0.079 typ. f3 1.90 2.40 0.075 0.094 f4 3.00 3.40 0.118 0.134 g 10.90 typ. 0.429 typ. h 15.45 16.03 0.608 0.631 l 19.85 21.09 0.781 0.830 l1 3.70 4.30 0.146 0.169 l2 18.30 19.13 0.720 0.753 l3 14.20 20.30 0.559 0.799 l4 34.05 41.38 1.341 1.629 l5 5.35 6.30 0.211 0.248 m 2.00 3.00 0.079 0.118 v 5 typ. 5 typ. v2 60 typ. 60 typ. dia. 3.55 3.65 0.140 0.144 h l2 l5 l l4 d e m l1 l3 f2 f3 f4 f1 v2 f(x3) g a v v dia
ordering information STPS60SM200C 6/7 doc id 018819 rev 1 3 ordering information 4 revision history table 6. ordering information order code marking package weight base qty delivery mode STPS60SM200Cw STPS60SM200Cw to-247 4.45 g 30 tube table 7. document revision history date revision changes 17-may-2011 1 first issue.
STPS60SM200C doc id 018819 rev 1 7/7 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2011 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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